N8
Recommend for Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake), FCLGA4189-4/5(Socket P4/P5), Aluminum Fin Stack, 5 Heatpipes with Vapor Chamber Base, Passive Cooler for 2U Server and up. Support 270W CPU powered heat dissipation.
* For Intel® 3rd Gen. Xeon Scalable Processor(code name Copper Lake, Socket LGA4189-5), DY-PK-4189-P5 Package Carrier needs to purchase separately.
Additional Information
Downloads
Video
|
CPU Support |
Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake) |
|
CPU Socket |
FCLGA 4189-4/5(Socket P4/P5) |
|
Solution |
2U Server and up |
|
Dimensions |
113 x 78 x 64 mm |
|
Weight |
500 g |
|
Material |
Aluminum Fin Stack ; 5 Heatpipes with Vapor Chamber Base |
|
Thermal Grease |
Shin-Etsu 7762 Pre-printed |
*All product specifications and product images are subject to change without notice.